Le Leti présentera lors de la conférence SPIE Advanced Lithography, ses derniers résultats sur la fabrication de capteurs et de dispositifs CMOS / photonique sur silicium avancés dans plusieurs papiers scientifiques.
Présentations du Leti :
Papier invité
- Advanced Etch Technology for Nanopatterning VI (Conference 10149)
Session 6 : Novel Plasma Patterning Techniques
“Nanoimprint, DSA and Multi-Beam Lithography: Patterning Technologies with New Integration Challenges”
Papier 10149-20
16h10 à 17h50
28 fév., Marriott, San Jose Salon III
Papiers communs
- Emerging Patterning Technologies 2017 (Conference 10144)
Session 3 : Nanoprint Masks and Applications
“New 3D structuring process for non-integrated circuit related technologies”
Papier 10144-11
11h20 à 11h40
28 fév.
Convention Center 210B
- Session 5 : Direct-Write, Maskless Lithography
“Overlay performance of MAPPER's FLX-1200”
Papier 10144-22
17h10 à 17h30
28 fév.
Convention Center 210B
- Session 6 : DSA Process and Integration
“Advanced surface affinity control for DSA contact hole shrink”
Papier 10144-23
8h50 à 9h10
1er mars
Convention Center 220C
- Session 11 : DSA Novel Materials
“A track process for solvent annealing of high-χ BCPs”
Papier 10146-31
14h30 à 14h50
1er mars
Convention Center 220C
18h00 à 20h00
28 fév.
Convention Center Hall 2
- “DSA Materials In-Film Defectivity Advanced Investigation”
- “DSA Process Window Extension Via Controlled Atmospheric Conditions Through Accurate Defectivity and Roughness Measurements”
- "The 300mm Evaluation of a 38nm Period Lamellar PS-b-PMMA for L/S Applications with Graphoepitaxy”
- “Rules-Based Correction Strategies Setup on Sub-Micrometer Line and Space Patterns for 200mm Wafer Scale SmartNILTM Process within an Integration Process Flow”