May 31
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Session 1: Heterogeneous Chiplet Integration
Location: Palazzo D
| Process Integration of Photonic Interposer for Chiplet-Based 3D Systems
| D. Saint-Patrice, S. Malhouitre, M. Assous, T. Pellerin, R. Velard, L. Virot, E. Deschaseaux, M.L Calvo-Munoz, K. Hassan, S. Bernabé, J. Charbonnier, Y. Thonnart
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Session 3: Advancements in Copper/Silicon-Oxide Hybrid Bonding
Location: Mediterranean 2 & 3
| Demonstration of a Wafer Level Face-To-Back (F2B) Fine Pitch Cu-Cu Hybrid Bonding With High Density TSV for 3D Integration Applications
| Jerzy-Javier SUAREZ-BERRU, Stéphane NICOLAS, Nicolas BRESSON, Myriam ASSOUS, Stepan BOREL,
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Session 6: Co-packaged Optical Assembly
Location: Mediterranean 7 & 8
| Advanced 3D Integration TSV and Flip Chip Technologies for Cost-Effective and Miniaturized Packaging of a 256 Channels Optical-Phased Array Based Beam Steering System Designed for Automotive LiDARs
| T. Mourier, N. Miloud-Ali, N. Raphoz*, Y. Sahouane, P. Peray, D. Saint Patrice, E. Deschaseaux, F. Simoens
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June 1
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Session 23: Next Generation Quantum, AI, and Secure System Design
Location: Mediterranean 6
| Characterizations of Indium Interconnects for 3D Quantum Assemblies
| Céline Feautrier, Edouard Deschaseaux, Alain Gueugnot, Jean Charbonnier, Frédéric Gustavo, Aurélia Plihon, Vivien Thiney, Ludovic Dupré, Franck Henry, Frédéric Berger, Antoine Pagot, Sébastien Renet, Olivier Mailliart, Candice Thomas feautrier
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June 2
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Session 28: Process Enhancements in 3D, FOWLP, and TSV Technologies
Location: Mediterranean 1
| Recent Progress in the Development of High-Density TSV for 3-Layers CMOS Image Sensors
| Stéphan BOREL, Myriam ASSOUS, Stéphane MOREAU, Rémi VELARD
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Session 33: Advances in RDL, Via, and TSV Technologies for Chiplet Integration
Location: Mediterranean 2 & 3
| 3D Silicon Interposer for Terabit/s Transcievers Based on High-Speed TSVs
| Bogdan Sirbu, Kai Zoschke, Ukyo Suzuki, Quentin Wilmart, Tolga Tekin
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Session 34: Bonding Assembly - Novel Packaging, Process, and Characterization
Location: Mediterranean 1
| Integration and Process Challenges of Self-Assembly Applied to Die-to-Wafer Hybrid Bonding
| Emilie Bourjot, Alice Bond, Noura Nadi, Thierry Enot, Loïc Sanchez, Pierre Montmeat, Benoit Martin, Alain Campo, Franck Fournel, Feras Eid, Johanna Swan
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