Download Leti Devices Workshop presentations
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Thank you for attending and making this event successful, filled with valuable networking opportunities. We hope to see you again next year!
For collaboration requests, please contact Thomas Signamarcheix.
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Highly efficient innovative technologies
for More the Moore solutions
Applications for More than Moore require cutting-edge solutions that combine efficient processing and innovative sensing. From curing to sensing, transporting and communicating, numerous factors are driving the roadmap to improve a variety of applications. During the Leti Devices Workshop, CEA-Leti experts will share their visions, innovations and achievements in these fields. Notably, the event will highlight key results in terms of efficient computing (FD-SOI, chiplet, memories), radiofrequency devices and innovative co-integration with sensors.
Speakers
Sébastien Dauvé
CEO, CEA-Leti
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Colette Maloney
Head of Unit - Microelectronics & Photonics Industry, European Comission
| Head of Silicon Component Division, CEA-Leti
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Elisa Vianello
Embedded AI Program Director, CEA-Leti
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Fabien Clermidy
Head of Digital Systems and Integrated Circuits Division, CEA-List
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System to Technology Transverse Programs Manager, CEA-Leti
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Research Engineer in Edge AI, CEA-Leti
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VP Strategic Development, CEA-Leti
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Workshop Program
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Welcome and workshop with:
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Chairman
Thomas Signamarcheix,
VP Strategic Development, CEA-Leti
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Welcome & Introduction
Sébastien Dauvé, CEO, CEA-Leti
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Title to be confirmed
Colette Maloney, Head of Unit - Microelectronics & Photonics Industry, European Comission
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Efficient neuromorphic computing using non-volatile memories
Elisa Vianello, Embedded AI Program Director, CEA-Leti
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Chiplet revolution: solutions for the rapidly changing semiconductor world
Fabien Clermidy, Head of Digital Systems and Integrated Circuits Division, CEA-List
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FD-SOI: supporting the 6G RF roadmap
Didier Belot, System to Technology Transverse Programs Manager, CEA-Leti
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Ultra Small-Edge AI to smarten sensors
Emmanuel Hardy, Research Engineer in Edge AI, CEA-Leti
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The path towards scaled and efficient FD-SOI technology
Olivier Faynot, Head of Silicon Component Division, CEA-Leti
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