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2020 Symposia on VLSI Technology and Circuits

Du 14/06/2020 au 19/06/2020
CONFERENCE VIRTUELLE

Avec un taux d'acceptation de l'ordre de 70 %, le CEA-Leti et ses partenaires présenteront une douzaine de papiers scientifiques lors du symposium 2020 sur les technologies et les circuits VLSI. Crise sanitaire oblige, ces présentations se feront sous format digital. Découvrez comment participer depuis votre poste de travail sur le site de la conférence.  

  • Téléchargez le programme (version en anglais)


​Thème

​Titre des papiers

​Premier auteur


​Premier auteur CEA-Leti

​      Affiliation      des autres auteurs

​Technology

7-Levels-Stacked Nanosheet GAA Transistors for High Performance Computing

​Sylvain Barraud (CEA-Leti)

​Sylvain Barraud

​Technology

All-operation-regime characterization and modeling of drain current variability in junctionless and inversion-mode FDSOI transistors

​​David Bosch (CEA-Leti)

​David Bosch
​IMEP-LAHC

​Technology

28nm FDSOI CMOS technology (FEOL and BEOL) thermal stability for 3D Sequential Integration: yield and reliability analysis

​C.Cavalcante (CEA-Leti)

​C.Cavalcante
​IMEP-LAHC
STMicroelectronics

​Technology

First demonstration of low temperature (≤500°C) CMOS devices featuring functional RO and SRAM bitcells toward 3D VLSI integration

​Claire Fenouillet-Beranger (CEA-Leti)

​Claire Fenouillet-Beranger
​Samsung

​Technology

Enabling UTBB Strained SOI Platform for Co-integration of Logic and RF: Implant-Induced Strain Relaxation and Comb-like Device Architecture
​Chen SUN
(National University of Singapore)
​Vincent Barral
​IMEC
SOITEC
STMicroelectronics

​Technology

Nanosecond Laser Anneal (NLA) for Si-implanted HfO2 Ferroelectric Memories Integrated in Back-End Of Line (BEOL)

Laurent Grenouillet (CEA-Leti)

​Laurent Grenouillet 

​NamLab (GE)

​Technology

Vertical Heterojunction Ge0.92Sn0.08/Ge GAA Nanowire pMOSFETs: Low SS of 67 mV/dec, Small DIBL of 24 mV/V and Highest Gm,ext of 870 μS/μm
Mingshan LIU (PGI 9, Jülich)
​Jean-Michel Hartmann
​Aachen University (GE)

​Technology

ExaNoDe: combined integration of chiplets on active interposer with bare dice in a multi-chip-module for heterogeneous and scalable high performance compute nodes
​Pierre-Yves Martinez (LIST)
​Jean Chabonnier
​3IT Univ. Sherbrooke (CA)
LN2, CNRS, Sherbrooke (CA)

​Technology

A SiOx RRAM-based hardware with spike frequency adaptation for power-saving continual learning in convolutional neural networks
I. Munoz-Martin (Politecnico di Milano)
​Jean-François Nodin
​Weebit

Technology

Variability Evaluation of 28nm FD-SOI Technology at Cryogenic Temperatures down to 100mK for Quantum Computing
​Bruna Cardoso Paz (CEA-Leti)

​Bruna Cardoso Paz

​CEA-IRIG
STMicroelectronics
IMEP-LAHC


​Circuits

SamurAI: a 1.7MOPS-36GOPS Adaptive Versatile IoT Node with 15,000x Peak-to-Idle Power Reduction, 207ns Wake-up Time and 1.3TOPS/W ML Efficiency

​Ivan ​Miro-Panades (LIST)

​Clément Jany

​STMicroelectronics

​Circuits

A 3.0μW@5fps QQVGA self-controlled wake-up imager with on-chip motion detection, auto-exposure and object recognition​Arnaud Verdant (CEA-Leti)

​Arnaud Verdant

​STMicroelectronics


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