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PYCSEL

The PYCSEL project aims to develop and demonstrate highly innovative fingerprint sensors based on TOLAE technology. This involves combining an innovative active thermal sensing frontplane, using PVDF-based pyroelectric material, with an IGZO TFT backplane on a plastic flexible foil. This system offers high resolution and a large surface area compliant with FBI standards as well as multiple fingerprint capture for easy integration, ergonomic use in future innovative cost-efficient fingerprint identification and conformability-based grip recognition systems targeting governmental and automotive applications.



Publié le 29 juillet 2021



PYroelectric Conformable SEnsor matrix for Large area applications in security and safety


The PYCSEL project aims to develop and demonstrate highly innovative fingerprint sensors based on TOLAE technology. This involves combining an innovative active thermal sensing frontplane, using PVDF-based pyroelectric material, with an IGZO TFT backplane on a plastic flexible foil. This system offers high resolution and a large surface area compliant with FBI standards as well as multiple fingerprint capture for easy integration, ergonomic use in future innovative cost-efficient fingerprint identification and conformability-based grip recognition systems targeting governmental and automotive applications.



 

Starting date : Jan. 2017 > Dec. 2019
 

Lifetime: 36 months


Program in support :  H2020-ICT-02-2016

Research and Innovation Action


 

Status project : complete


CEA-Leti's contact :

Audrey Martinent

Jean-François Mainguet

Bernard Strée


 


Project Coordinator: CEA-Liten (FR)

Partners:  

  • BE: Imec
  • FR: CEA, Idemia, IrLynx
  • IT: Bioage
  • NL: TNO
  • SE: Autoliv
  • SP: UC3M



Target market: n/a



Publications:

  • «PYCSEL – Project introduction / EAB Research Projects
    Conference», J.F. Mainguet, (EAB-RPC) 2017 / Darmstadt /
    19-sep-2017.

  • «Best Publicly-Funded Project Demonstrator Award:
    PYCSEL H2020 - Thin Thermal Fingerprint Sensor»,
    A. Martinent, LOPEC 2019 / Munchen / 20-mar-2019.
    • «Un capteur d’empreinte digitale thermique actif et la
    détection du vivant», J.F. Mainguet / PYCSEL, Journées
    Nationales 2019 du GDR Sécurité Informatique / Paris /
    13-jun-2019.


  • «Un capteur d’empreinte digitale thermique actif et la
    détection du vivant», J.F. Mainguet / PYCSEL, Journées
    Nationales 2019 du GDR Sécurité Informatique / Paris /
    13-jun-2019.

  • «A new flexible active thermal fingerprint sensor: hot image
    results», J.F. Mainguet, M.Pouet / PYCSEL, EAB Research
    Projects Conference (EAB-RPC) 2019 / Darmstadt
    17-sep-2019.

  • «A large-area curved pyroelectric fingerprint sensor»,
    JF. Mainguet, D. Gallaire, A. Martinent, A. Revaux,
    M. Benwadih, S. Charlot, A.J.J.M van Breemen,
    J.-L. van der Steen, H.B. Akkerman, A.J. Kronemeijer,
    G.H. Gelinck, M. Pouet, J.-Y. Fourré, S. Sinopoli, U. Emanuele,
    L. Fritsch, J. Liu Jimenez, J. Karlsson, F. De Roose, S. Steudel
    / IEDM 2019 65th International Electron Devices Meeting /
    San Francisco / 10-dec-2019.




Investment:  € 3.8 m.

EC Contribution€ 3.8 m.

Stakes

  • The outcomes provided by the two CEA institutes involved in the project (CEA-Liten as coordinator and CEA-Leti as contributor).

  • Specifications, design and manufacturability 
    CEA has contributed to the mask layout of the three prototypes: PYCSEL1 is a basic test vehicle for process development, PYCSEL2 is an intermediate prototype capable of single finger acquisition and PYCSEL3 is the final 4-finger sensor. CEA has been the main contributor of thermal active sensing and has performed all the thermal simulations with COMSOL to predict the charges generated and the expected contrast between ridges and valleys, depending on layer organization and thicknesses, and injected thermal power.

  • Sensor process flow and reliability
    CEA manufactures the frontplane section of the sensor located above the backplane IGZObased TFT array made by TNO using printing-based technologies. The specific pyroelectric layer is composed of PVDF-TrFE. CEA has also checked the frontplane reliability: the sensor must resist environmental changes and chemical and mechanical constraints as the fingers are contacting.

  • System integration
    CEA is participating in the system architecture design using inputs from thermal simulations conducted in WP1. It is also characterizing the results for comparison with simulations.

OBJECTIVES


  • The PYCSEL project development combines a printed pyroelectric organic sensor with active matrix TFT arrays on a mechanically-robust plastic foil. It focuses on user requirements in terms of easy system integration, conformability, ergonomics, large area acquisition and high resolution (Fingerprint Acquisition Profile plain 4-fingers - FAP60: 1600x1500 pixels @500 ppi).

  • The system involves integrating a printed pyroelectric Poly[vinylidene difluoride] (PVDF)-based sensor layer on a flexible Indium Gallium Zinc Oxide (IGZO) active matrix TFT foil to give a thin conformable fingerprint sensor without the need for any optical bulky and/or costly additional components. It offers differentiating properties for the portable governmental market since it provides a breakthrough in terms of mechanical robustness and conformability: advantages which also increase fingerprint sensor penetration into automotive (personalized human-machine interfaces or HMIs), machine-tool (user-restricted HMI), building (access control) and consumer (PCs) markets.


IMPACT

  • This is the first very large (4-finger) thermal active fingerprint sensor on a IGZO-based TFT active matrix using PVDF as the pyroelectric layer.