Starting date: Apr. 2018 > Dec 2021
Lifetime: 45 months
Program in support
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Status of project : in progress
Project Coordinator: SOITEC
Partners:
EVG (AT)Airbus, AED, AUDI, Bosch, University of Tübingen (EKUT), Fraunhofer, GF, HSEB, MunEDA, Technische Universität Dresden, Universität der Bundeswehr München, Universität Paderborn (DE)
ISD SA (EL)EVOTEL Informatica SL (ES)
CEA-Leti, D&R, IBS Institut National Polytechnique Grenoble,IMS, Kalray, M3S, Soitec,STMicroelectronics, Thales (FR)
Publications
Crack Front Interaction with Self-Emitted Acoustic Waves
D. Massy, F. Mazen, D. Landru, N. Ben Mohamed, S. Tardif, A. Reinhardt, F. Madeira, O. Kononchuk, and F. Rieutord, PHYSICAL REVIEW LETTERS 121, 195501 (2018)
This project received funding from the JU ECSEL, from the French government as part of the Nano2022 program and from the Auvergne-Rhône-Alpes region.
Number of patents: n/a
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Stakes
CEA-Leti’s contribution to OCEAN12 embraces two areas: the SOI technology platform and design work. Regarding the SOI technology platform, CEA-Leti is developing pathfinding solutions to push 12FDX technology performance. These solutions are divided between two areas of research:
At device level: evaluation of disruptive processes to boost device performance; several approaches are being implemented in parallel.SiN stress change by plasma treatment: this concept is being developed with IBS; It takes advantage of Plasma Immersion Ion Implantation capability. The method’s ability to transform SiN layer stress from tension to compression has been demonstrated and it opens up the path to innovative dual CESL integration.
MOL: for the first time, a morphological evaluation of F-free W liner compared with a conventional TiN liner has been conducted on FD-SOI lots.Encouraging morphological results have been achieved and electrical packages are ongoing to quantify the related performance gain.
BOX Creep: the ability of this innovative strain engineering technique to boost pMOS performancehas been quantified for a wider thermal budget window. For the first time, BOX Creep is also being studied using TiN, which offers a new solution to boosting nMOS performance.
At substrate level: development of an innovative substrate process to boost performance and improve the SOI quality.An alternative SOI process using an EPI-based donor, has been demonstrated for controlling SOI thickness and roughness without the need for high temperature or CMP finishing.Understanding the fracture dynamic is of prime interest because this can affect the SOI morphology. A method for imaging fracture propagation in situ has been developed based on synchrotron radiation.
OCEAN12 targets the key societal challenge of smart mobility. Based on innovative FD-SOI technology, OCEAN12 will develop new processors and applications that leverage Fully Depleted Silicon On Insulator (FD-SOI) technology to offer theindustry’s lowest power consuming processor for automotive and aeronautic applications, in particular.
OCEAN12 will develop a technology platform benefitting from the extreme low leakage and operating voltage (Vdd) scalability of FD-SOI design, which will be achieved by reverse and forward body biasing (RBB/FBB) of the integrated circuit and its power system architecture. This high performance, low power solution will equip the upcoming strategic generations of smart vehicles. The platform will rely on:Pilot line facilities capable manufacturing advanced substrates compatible with 12FDX technology and defining pathfinding solutions to push 12FDX technology performance and innovative sensor development
Development of innovative designs to enhance FD-SOI capacity and guarantee the highest level of integrated solutions
Manufacturing high performance ICs using every feature of FD-SOI technologies.
The highly integrated, reliable, ultra low power and cheaper components will be integrated into complex embedded systems accessible to TIER-1, 2 and OEMs to meet the strategic challenges of future vehicles. Several product demonstrators are targeted including a high end microcontroller plug-and-play board, high-performance sensor data fusion, highly integrated low power video processing and awaking systems. This project creates a high added value network to strengthen a competitive European value chain on a European breakthrough and secure a unique FD-SOI roadmap beyond the 22FDX. Finally, OCEAN 12 highlights Europe’s unique leading position in FD-SOI technology by integrating the entire manufacturing chain, from substrate suppliers and foundries to TIER-1 and OEM - including academia and RTO’s - into this dynamic.
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Through these studies of the 12nm node, OCEAN12 paves the way to creating necessary momentum to offer FD-SOI the possibility of developing technologies manufactured in Europe for a sub-20nm node or even below. OCEAN12 promotes a close relationship between major European industrials, including end users, SME’s and academics, to establish a unique European network of FD-SOI excellence specifically in the service of autonomous mobility applications.
It provides CEA-Leti with the opportunity to realize advanced developments in the materials and substrates needed for the 12nm node in cooperation with SOITEC and to prepare the related technological bricks in connection with Global Foundries.
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