Vous êtes ici : Accueil > Determination of the input parameters for inelastic background analysis combined with HAXPES using a reference sample

Publications

Determination of the input parameters for inelastic background analysis combined with HAXPES using a reference sample

Publié le 1 octobre 2018
Determination of the input parameters for inelastic background analysis combined with HAXPES using a reference sample
Auteurs
Zborowski C., Renault O., Torres A., Yamashita Y., Grenet G., Tougaard S.
Year2018-0051
Source-TitleApplied Surface Science
Affiliations
Univ. Grenoble Alpes, F-38000 Grenoble France & CEA, LETI, MINATEC Campus, Grenoble, France, National Institute for Materials Science (NIMS), 1-1 Namiki, Tsukuba, Ibaraki, Japan, Institut des Nanotechnologies de Lyon, Ecole Centrale de Lyon, 36 avenue Guy de Collongue, Ecully Cedex, France, Department of Physics, Chemistry and Pharmacy, University of Southern Denmark, Odense M, Denmark
Abstract
The recent progress in HAXPES combined with Inelastic Background Analysis makes this method a powerful, non-destructive solution to get quantitative information on deeply buried layers and interfaces at depths up to 70 nm. However, we recently highlighted the need for carefully choosing the scattering cross-sections in order to accurately describe the transport of photoelectrons through a complex overlayer structure with layers presenting very different scattering properties. It is found that the transport through such thick bi-layer structures can be described with an effective inelastic scattering cross-section in the form of a weighted sum of individual cross-sections of the pure layers. In this study, we have experimentally investigated this by analyzing Al/Ta/AlGaN stacks on a GaN substrate. We present a refined analytical method, based on the use of a reference spectrum, for determining the required input parameters, i.e. the inelastic mean free path and the effective inelastic scattering cross-section. The use of a reference sample gives extra constraints which make the analysis faster to converge towards a more accurate result. Based on comparisons with TEM, the improved method provides results determined with a deviation typically better than 5% instead of around 10% without reference. The case of much thicker overlayers up to 66 nm is also discussed, notably in terms of accounting for elastic scattering in the analysis. © 2017 Elsevier B.V.
Author-Keywords
Buried interface, Hard X-ray photoemission, HEMTs, Inelastic background analysis, Inelastic scattering cross-section
Index-Keywords
High electron mobility transistors, Surface phenomena, Surfaces, Background analysis, Buried interface, Hard X-ray photoemission, Inelastic mean free path, Quantitative information, Reference spectrum, Scattering cross section, Scattering property, Inelastic scattering
ISSN1694332
Lien vers articleLink

Retour à la liste