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Redistribution of phosphorus during Ni0.9Pt0.1-based silicide formation on phosphorus implanted Si substrates

Publié le 1 octobre 2018
Redistribution of phosphorus during Ni0.9Pt0.1-based silicide formation on phosphorus implanted Si substrates
Auteurs
Lemang M., Rodriguez P., Nemouchi F., Juhel M., Grégoire M., Mangelinck D.
Year2018-0052
Source-TitleJournal of Applied Physics
Affiliations
STMicroelectronics, 850 rue Jean Monnet, Crolles, France, Univ. Grenoble Alpes, Grenoble, France, CNRS, Aix Marseille Université, IM2NP (UMR 7334), Faculté de Saint-Jérôme, Marseille Cedex, France, CEA, LETI, MINATEC Campus, Grenoble, France
Abstract
Phosphorus diffusion and its distribution during the solid-state reactions between Ni0.9Pt0.1 and implanted Si substrates are studied. Silicidation is achieved through a first rapid thermal annealing followed by a selective etching and a direct surface annealing. The redistribution of phosphorus in silicide layers is investigated after the first annealing for different temperatures and after the second annealing. Phosphorus concentration profiles obtained thanks to time of flight secondary ion mass spectrometry and atom probe tomography characterizations for partial and total reactions of the deposited 7 nm thick Ni0.9Pt0.1 film are presented. Phosphorus segregation is observed at the Ni0.9Pt0.1 surface and at Ni2Si interfaces during Ni2Si formation and at the NiSi surface and the NiSi/Si interface after NiSi formation. The phosphorus is evidenced in low concentrations in the Ni2Si and NiSi layers. Once NiSi is formed, a bump in the phosphorus concentration is highlighted in the NiSi layer before the NiSi/Si interface. Based on these profiles, a model for the phosphorus redistribution is proposed to match this bump to the former Ni2Si/Si interface. It also aims to bind the phosphorus segregation and its low concentration in different silicides to a low solubility of phosphorus in Ni2Si and in NiSi and a fast diffusion of phosphorus at their grain boundaries. This model is also substantiated by a simulation using a finite difference method in one dimension. © 2018 Author(s).
Author-Keywords
 
Index-Keywords
Annealing, Binary alloys, Finite difference method, Grain boundaries, Mass spectrometry, Nickel compounds, Plants (botany), Rapid thermal annealing, Secondary ion mass spectrometry, Segregation (metallography), Silicides, Solid state reactions, Surface segregation, Atom probe tomography, Low concentrations, Phosphorus concentration, Phosphorus diffusion, Phosphorus segregation, Selective etching, Silicide formation, Time of flight secondary ion mass spectrometry, Phosphorus
ISSN218979
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