In this work, a comparative study of three different Entegris FOUP platforms and materials (PC, PC/CP and EBM/CNT) is carried out in order to assess and compare their capacity to be contaminated by HF and HCl, their molecular outgassing caused by the same contamination dose and their actual contamination transfer to Cu-coated wafers exposed within each FOUP. The results presented hereby allow us to evidence the higher mobility and affinity of the HF for the polymers of the FOUP and the Cu-coated wafers with respect to the HCl case. It is also demonstrated that high outgassing concentrations are not directly related to a large contamination transfer to wafers since each phenomenon is predominantly governed by the solubility or diffusivity parameter respectively. Furthermore, the EBM/CNT FOUP arises as the best of the three tested FOUPs in terms of contamination transfer to the Cu-coated wafers due to its lower HF and HCl affinities shown during the contamination phase regarding the others (PC and PC/CP FOUPs). Definitely, it is highly recommended to follow an experimental wafer exposure protocol in order to decide the suitability of a FOUP according to any sensitive fabrication step whatsoever. © 2016