A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m
| Auteurs | Dolatsha N., Grave B., Sawaby M., Chen C., Babveyh A., Kananian S., Bisognin A., Luxey C., Gianesello F., Costa J., Fernandes C., Arbabian A. |
| Year | 2017-0174 |
| Source-Title | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
| Affiliations | Stanford University, Stanford, CA, United States, CEA-LETI-MINATEC, Grenoble, France, University of Nice, Nice, France, STMicroelectronics, Crolles, France, Instituto de Telecomunicações, Lisbon, Portugal, ISCTE-IUL, Lisbon, Portugal, University of Lisbon, Lisbon, Portugal |
| Abstract | Low-cost, energy efficient, high-capacity, scalable, and easy-to-deploy point-to-point wireless links at mm-waves find a variety of applications including data intensive systems (e.g., data centers), interactive kiosks, and many emerging applications requiring data pipelines. Operating above 100GHz enables compact low-footprint system solutions that can multiplex Tb/s aggregate rates for dense deployments, therefore competing with wired solution in many aspects including rate and efficiency, but much more flexible for deployment. The focus is on small-footprint fully integrated solutions, which overcome traditional packaging challenges imposed at >100GHz with commercial and low-cost solutions. © 2017 IEEE. |
| Author-Keywords | |
| Index-Keywords | Antennas, Energy efficiency, Lens antennas, Microstrip antennas, Millimeter waves, Data-intensive systems, Emerging applications, Energy efficient, Fully integrated, Interactive kiosks, Low-cost solution, Small footprints, Wireless systems, 3D printers |
| ISSN | 1936530 |
| Lien vers article | Link |