Low temperature direct bonding comparison
| Auteurs | Fournel F., Larrey V., Morales C., Bridoux C., Moriceau H., Rieutord F. |
| Year | 2017-0281 |
| Source-Title | Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 |
| Affiliations | Univ. Grenoble Alpes, Grenoble, France, CEA, LETI, MINATEC, Grenoble, France |
| Abstract | Low temperature direct bonding technologies are now widely used for many applications. Mechanisms of some of these technics will be presented. The different way to obtain low temperature direct bonding will then be compared with their respective advantages and drawbacks. © 2017 JSPS 191st Committee on Innovative Interface Bonding Technology. |
| Author-Keywords | |
| Index-Keywords | Low temperature operations, Temperature, Three dimensional integrated circuits, Low temperature direct bonding, Bonding |
| ISSN | |
| Lien vers article | Link |