Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes
| Auteurs | Santos C., Vivet P., Thuries S., Billoint O., Colonna J.-P., Coudrain P., Wang L. |
| Year | 2017-0335 |
| Source-Title | 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 |
| Affiliations | Univ. Grenoble Alpes, Grenoble, France, CEA, LETI, MINATEC Campus, Grenoble, France, STMicroelectronics, 850 rue Jean Monnet, Crolles, France, Calibre Design Solutions, Mentor Graphics, Fremont, CA, United States |
| Abstract | CoolCube™ is a monolithic 3D technology which has the potential to solve the interconnection density limitation of the existing TSV-based 3D integration processes. Since the active devices are fabricated on extremely this die substrates, heat dissipation has been pointed as a potential showstopper issue for this emerging technology. This work provides a comparative study of the thermal performance of the CoolCube and TSV-based 3D integration processes for a range of technology parameters and application scenarios. Results show that CoolCube exhibits thermal performance similar to or even better than the TSV-based technologies thanks to its very tight die-to-die thermal coupling. © 2016 IEEE. |
| Author-Keywords | |
| Index-Keywords | Integration, Monolithic integrated circuits, 3-D integration, Application scenario, Comparative studies, Emerging technologies, Interconnection density, Technology parameters, Thermal coupling, Thermal Performance, Three dimensional integrated circuits |
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