Thin film packaged redundancy RF MEMS switches for space applications
| Auteurs | Souchon F., Saint-Patrice D., Pornin J.L., Bouchu D., Baret C., Reig B. |
| Year | 2017-0361 |
| Source-Title | TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems |
| Affiliations | CEA, LETI, MINATEC, Grenoble, France |
| Abstract | A low cost packaging solution has been successfully implemented on RF MEMS switches. The encapsulation is made at wafer level by thin film packaging, it allows keeping very small footprint for the device and is fully compatible with wire bonding and flip chip assembly. In addition to their highly shrinked size, packaged switches excellent microwave performances and promising behaviors in terms of reliability, especially for redundancy schemes required by space applications. © 2017 IEEE. |
| Author-Keywords | contact degradation, creep, dielectric charging, encapsulation, MEMS switches, Wafer level packaging |
| Index-Keywords | Actuators, Chip scale packages, Creep, Electric switches, Electronics packaging, Encapsulation, Flip chip devices, Microsystems, Redundancy, Space applications, Thin films, Transducers, Wafer bonding, Contact degradation, Dielectric charging, Flip chip assemblies, Low-cost packaging, MEMS switches, Microwave performance, Thin film packaging, Wafer level packaging, Solid-state sensors |
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| Lien vers article | Link |