Direct Bonding and Debonding Approach of Ultrathin Glass Substrates for High Temperature Devices
| Auteurs | Bedjaoui M., Poulet S. |
| Year | 2017-0395 |
| Source-Title | Proceedings - Electronic Components and Technology Conference |
| Affiliations | Univ. Grenoble Alpes, Grenoble, France, CEA, LETI, Minatec Campus, Grenoble, France |
| Abstract | The advent of flexible thin-film electronic devices on ultrathin substrates is driven by the need to develop alternative handling methods fully compatible with front-end and back-end processes. The purpose of this work is to present a new handling approach for ultrathin glass substrates based on direct glass-glass bonding and peel-off debonding at room temperature. This concept is evaluated through the realization of thin-film batteries (500?m) without intermediate layer. The stack of thin film battery is fabricated using sequential physical vapor depositions at temperature values up to 400°C. The debond process is completed at room temperature by mechanical peel-off of the encapsulation film laminated on thin film battery. As the results, there is no sign of any crack of the ultrathin glass ( |
| Author-Keywords | Bonding process, Debonding technique, Handling, Thin film batteries, Ultrathin glass |
| Index-Keywords | Debonding, Electric batteries, Electrochemical impedance spectroscopy, Glass, Network components, Secondary batteries, Substrates, Thin films, Bonding process, Galvanostatic cycling, Handling, High temperature device, Intermediate layers, Thin film battery, Ultrathin glass, Ultrathin glass substrates, Glass bonding |
| ISSN | 5695503 |
| Lien vers article | Link |