Flexible metal-semiconductor-metal device prototype on wafer-scale thick boron nitride layers grown by MOVPE
Auteurs | Li X., Jordan M.B., Ayari T., Sundaram S., El Gmili Y., Alam S., Alam M., Patriarche G., Voss P.L., Paul Salvestrini J., Ougazzaden A. |
Year | 2017-0489 |
Source-Title | Scientific Reports |
Affiliations | UMI 2958, Georgia Tech - CNRS, Metz, France, Georgia Institute of Technology, School of Electrical and Computer Engineering, GT-Lorraine, Metz, France, CEA-LETI, Minatec Campus, Grenoble, France, Centre de Nanosciences et de Nanotechnologies, Université Paris-Saclay, C2N - Site de Marcoussis, Route de Nozay, Marcoussis, France, Université de Lorraine, LMOPS, EA 4423, Metz, France |
Abstract | Practical boron nitride (BN) detector applications will require uniform materials over large surface area and thick BN layers. To report important progress toward these technological requirements, 1?2.5 ?m-thick BN layers were grown on 2-inch sapphire substrates by metal-organic vapor phase epitaxy (MOVPE). The structural and optical properties were carefully characterized and discussed. The thick layers exhibited strong band-edge absorption near 215 nm. A highly oriented two-dimensional h-BN structure was formed at the film/sapphire interface, which permitted an effective exfoliation of the thick BN film onto other adhesive supports. And this structure resulted in a metal-semiconductor-metal (MSM) device prototype fabricated on BN membrane delaminating from the substrate. MSM photodiode prototype showed low dark current of 2 nA under 100 V, and 100 ± 20% photoconductivity yield for deep UV light illumination. These wafer-scale MOVPE-grown thick BN layers present great potential for the development of deep UV photodetection applications, and even for flexible (opto-) electronics in the future. © 2017 The Author(s). |
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ISSN | 20452322 |
Lien vers article | Link |