Down to 15nm BOX: SOI extendability for planar fully depleted application beyond 22FD
Auteurs | Schwarzenbach W., Allibert F., Le Royer C., Grenouillet L., Malaquin C., Bertrand-Giuliani C., Boedt F., Loubriat S., Michau C., Parissi D., Nguyen B.-Y. |
Year | 2017-0094 |
Source-Title | 2016 SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2016 |
Affiliations | Soitec, Parc Technologique des Fontaines, Bernin, France, CEA, LETI, MINATEC Campus, Grenoble, France |
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Lien vers article | Link |