• Because conventional chips can't keep up with the upcoming of most sophisticated AI supported within devices, a growing need for semiconductor technologies has emerged. Yesterday's Cloud-based Web giant are now heavily investing into the semiconductor industry, and actively looking for new R&D solutions to migrate most AI to the edge. 

• To help industry keep up the race and integrate AI into already ultra-miniaturized chips, CEA-Leti's launched a specific Edge AI program to pioneer quick and reliable semiconductor solutions, from computing, sensing to data storage.  

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In-Memory Computing

• One focus is a fundamental problem of modern computing, moving data between memory and processor now costs vastly more than computation. Data transfer and memory access account for up to 90% of system energy usage. CEA-Leti is specifically developing neuro-inspired architectures to explore new programming models, and "In-Memory Computing" to bridge the gap between memory and logic units.

• CEA-Leti and its partners are involved in MYCUBE an ERC-backed project to stack memories onto processors. The ERC-backed My Cube project is setting its sights on the first-ever in-memory computing technology. The goal is to be able to carry out simple computations directly in a circuit's memory.  A demonstrator built on silicon nanowires—the most appropriate for the application—and non-volatile resistive memory will be completed in 2022, using 20 times less energy than a conventional circuit. CEA-Leti work on advanced 3D stacking strategies (to integrate an additional memory layer on top of the logic unit). 
  

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​ © CEA-Leti​

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