3D Technology Bricks
CEA-Leti offers state-of-the-art technology bricks using 200 & 300mm industrial tools to enable 3D high performance applications: from computing, telecommunication to heterogeneous technologies
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High aspect ratio TSVs
CEA-Leti’s offers strong expertise in high aspect ratios TSVs, including: - via-mid TSVs with a diameter in the range of 10-12μm for a height between 80 and 120μm with excellent electrical performances and filling demonstration
- new gen. of high density TSVs with diameter 1-2μm as well as high aspect ratio TSV last (AR>5)
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Fine pitch copper pillars & assembly
Fine pitch interconnection is key to support 3D silicon stacking roadmaps. CEA-Leti offers: - 20μm diameter (40μm pitch) μbumps and μpillars, including R&D to stabilize lower diameter interconnection process
- strong knowledge in thermocompression die-to-wafer stacking and related underfill technologies, including fine pitch interconnection
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Fine pitch and beyond hybrid bonding
From design to fabrication and electrical characterization, CEA-Leti offers various hybrid bonding solutions using full 300&200mm fabrication lines including Known Good Dies: - wafer-to-wafer and die-to-wafer bonding technologies
- multi-layer hybrid bonding techniques with fine connection pitches (<1μm) to support various technologies with high bandwidth
- emerging bonding techniques and modules for next gen. of ultra-fine die alignment (<200nm)
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Interposer stress management strategy
CEA-Leti offers extensive expertise in the evaluation of stress issues within interposers: - TSVs induced stress
- warpage control of large interposers
- chip/package Interaction
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