With more than 11,000 sq. m (120,000 sq. ft.) of cleanrooms, a complete range of the latest industrial process equipment, and some of the most advanced nanocharacterization capabilities available anywhere—all staffed by our experts and all under one roof—we can help you reduce cycle times, de-risk your innovation projects, and get your differentiating new product to the market faster.
We can work with wafers from 100 mm to 300 mm and on samples as small as a few square centimeters. Our tools and processes also cover a wide range of manufacturing readiness levels (MRL). Depending on your needs, we can help you overcome a specific challenge on a component of your product, scale an entire new product up for manufacturing in one to two years, or work with you to bring emerging technologies to proof of concept over several years.
Continuous investment in the latest equipment
CEA-Leti’s cleanrooms, ISO-9001-certified and open 24/7, are designed specifically for the development and fabrication of innovative components for our partners, who can access our CMP, deposition, photolithography, etching, bonding, interconnect fabrication, and testing capabilities—all for 100 mm to 300 mm silicon wafers.
Our cleanroom services include more Moore, beyond CMOS, and more-than-Moore microelectronics; substrates, with particular expertise in FD-SOI; power components, MEMS and NEMS, non-volatile memory, imagers and displays, silicon photonics, and 3D integration.
Finally, our CMOS, MEMS, co-integration, 3D integration, and photonics lines are backed by our characterization platform, home to an additional 50 pieces of equipment, and a robust IP and confidentiality policy to protect your innovation.
The CEA’s tools and processes can help reduce your cycle times, de-risk your innovation projects, and get your differentiating new product to the market faster.
End-to-end innovation capabilities
We invest in new equipment every year for state-of-the-art capabilities for today and for the next generation of technology covering:
- Substrate, component, and IC design, simulation, prototyping, advanced characterization, and testing
- Process development and testing, including process equipment testing and evaluation
- Lifecycle Analyses early in the development cycle