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Liste de actualités du Leti
Integrity and confidentiality of embedded neural networks – Tackling security threats in the physical dimension
In collaboration with Smiths Detection, CEA-Leti developed an innovative detection module for small-angle X-ray diffraction. This module is integrated into a novel type of airport baggage-scanner. The SDX 10060 XDi is marketed by Smiths Detection and had its world premiere at the Passenger Terminal Expo in Frankfurt, Germany, on April 16-18, 2024.
CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits detailing the institute's progress on 3D integration technologies, which are a promising approach for designing More than Moore systems, especially radio frequency (RF) integrated systems.
Companies of all types and sizes—from startups to established corporations—can work with the CEA, leveraging the expertise of both CEA-List and CEA-Leti, to develop next-generation integrated circuits for consumer electronics, automotive systems, medical devices, and other tech-intensive products. Learn how CEA experts are helping companies quickly and efficiently take their product innovations from lab to fab.
Trans-Atlantic Collaboration Starts with Focus on Enabling Next-Gen Magnetic Memory Devices at the 300mm Wafer Scale
In the latest Clarivate ranking of the world's top 100 innovators, CEA is ranked 31st and first among public research organizations. This performance rewards CEA-Leti's policy of promoting innovation and its scientific and economic impact, notably through the filing of patent applications.
The need for reliable methods to ensure the safety and security of Edge artificial intelligence systems has never been more pressing. With regulations like the EU’s AI Act sharpening the collective focus on AI trustworthiness, risk, and acceptability, CEA-Leti made a breakthrough on the often-overlooked physical threats to AI systems, demonstrating a robust evaluation method on a common IoT use case.
Quantum transistors are a promising technology for the future of electronics. They could give rise to computers that are more powerful, more energy-efficient and more secure than classical computers. However, their integration remains a major technological challenge. In order to enable the manufacturing of these new architectures a plasma etching method called atomic layer etching is used.
With years of expertise in silicon photonics, CEA-Leti researchers have developed two complementary approaches for high performance photon detectors. This innovative technology meets the needs of disruptive applications in a variety of sectors such as Free Space Optics for telecoms, quantum computing and quantum cryptography. Depending on application requirements, CEA-Leti now offers cutting-edge solutions using either Avalanche Photodetectors (APD) with Mercury Cadmium Telluride (MCT) or Superconducting Single Photon Detectors (SSPD).
CEA-Leti is proud to announce the kick-off meeting today of the FAMES Pilot Line, a pioneering project aimed at advancing semiconductor technologies in Europe. This 830 M€ initiative aligns with the ambition of the EU Chips Act, which seeks to bolster EU semiconductor capabilities and ensure technological sovereignty.
Epitaxy has become a key process in the development of devices that rely on substrates. While epitaxy refers to the general ability to grow crystals or deposit a material on a substrate, there are numerous types of epitaxy, which each have their own fields of application. Expertise at CEA-Leti covers a wide range of applications, including recent work on Nitride Epitaxy, particularly adapted to power or radio-frequency transistors as well as micro-LEDs.
This work demonstrates Feasibility of Combining Hybrid Bonding and High-Density Through-Silicon Vias
CEA-Leti's cornerstone research on silicon carbide substrates initially gained traction in 2019 with Soitec on booming demand from the electric vehicle market and a scarcity of monocrystalline silicon. Today, with four presentations at ICSCRM 2023 showcasing pioneering advances in transferred silicon carbide substrates for electronics and photonics, CEA-Leti continues to lead the way in silicon carbide and thin film transfer technologies.
As published in the March April 2024 issue of Chip Scale Review
The European InSecTT project focuses on the security of embedded AI. As a partner in this three-year project, CEA-Leti developed innovative solutions to authenticate intelligent systems and protect them from various cyberattacks. These advances coincide with the promulgation of the European AI Act.
Gaël Pillonnet, a seasoned energy conversion expert at CEA-Leti, has come up with an ingenious solution that significantly reduces the energy consumption of traditional transistors, albeit at a slower computation speed. This opens up a host of possibilities for achieving energy efficiency and computational performance, especially in edge computing.
The IEEE, the largest international professional association devoted to electricity and electronics, has recognized the achievements of Olivier Faynot, the Director of CEA-Leti's Silicon Components Department, for his exceptional achievements with advanced CMOS components.
CEA-Leti combined its hardware and software expertise to investigate the benefits of new signal processing approaches to conventional Time-of-Flight (ToF) histogram acquisition schemes. Among the techniques developed are compressive sensing and expectation-maximization algorithms. Both turned out to be promising avenues for reducing hardware design constraints in active direct ToF 3D imaging based on SPAD pixels.
A specialist in ultra-miniature rechargeable batteries for medical devices, the startup is acquiring an industrial site 15 km from CEA-Leti. It will ultimately employ 50 people. Volume manufacturing is to begin late 2026.
Engaging Multiple EU Partners, the Projects Will Apply Intelligent Sensing and AI-Enabled Learning Technologies.
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.