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Wafer-level testing of photonic circuits speeds up development


Published on 19 July 2021
  • ​Optically-coupled photonic chips cannot currently be tested at wafer level. Instead, they must be cut, packaged, and then tested individually. CEA-Leti successfully demonstrated an automated testing solution that removes this hurdle. A custom probe from Teem Photonics ensures very broad bandwidth and unparalleled measurement dynamics of more than 60 dB. It is capable of characterizing virtually all optical components.

  • The probe just needs a track in the silicon substrate measuring a few hundred microns in depth to operate. This method could remove a significant barrier to scaling up wavelength multiplexing circuits for manufacturing. The advance is one of the results of the European Masstart project, which runs until the end of 2021.


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