​This CEA-Leti and IRT Nanoelec partner recently signed an agreement with SUSS MicroTec to develop the NEO HB flip-chip machine for die-to-wafer (D2W) hybrid bonding. Germany-based SUSS MicroTec, which employs around 1,000 people, provides process and equipment solutions to the semiconductor industry. A prototype of SET's machine was installed in CEA-Leti's clean rooms in 2017.

Qualification testing took place in several stages as part of research for the IRT Nanoelec 3D program and was completed in 2019. Several papers were presented at major conferences as a result of this research. So, when SET first commercialized the NEO HB, it was already well-known and sales ramped up quickly.
SET, the world's leading supplier of flip-chip machines, will now add a new solution to its lineup.

*In flip-chip assembly, the die is attached bond pad side down to the substrate using conductive bumps.

Source: Minanews