High-Performance Computing gets more energy-efficient data transfer

The 3D-NoC network-on-chip developed by Leti, STMicroelectronics, and Mentor Graphics under a project coordinated by IRT Nanoelec offers 20% to 40% less energy consumption and higher speeds than other NoCs.

Published on 20 February 2017

The NoC developed is built on two 28 nm FDSOI stacked circuits, each with 96 processor cores. The cores are integrated on a 65 nm CMOS active interposer layer, which ensures communication between the cores and electrical conversion, reducing the distance between cores to just a few hundred microns. For discrete components on an electronic circuit board, the distance can be several centimeters.

A circuit is currently in fabrication and should be delivered in early 2017. Given the maturity of the technology, it could be transferred to a manufacturer very rapidly.

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Keywords : CMOS | low power | network-on-chip | 3D-NoC | industry | FDSOI

Alternative and Atomic Energies Agency

CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.

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High-Performance Computing gets more energy-efficient data transfer

The 3D-NoC network-on-chip developed by Leti, STMicroelectronics, and Mentor Graphics under a project coordinated by IRT Nanoelec offers 20% to 40% less energy consumption and higher speeds than other NoCs.

Keywords : CMOS | low power | network-on-chip | 3D-NoC | industry | FDSOI

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In the same section :

High-Performance Computing gets more energy-efficient data transfer

​The 3D-NoC network-on-chip developed by Leti, STMicroelectronics, and Mentor Graphics under a project coordinated by IRT Nanoelec offers 20% to 40% less energy consumption and higher speeds than other NoCs.

Keywords : CMOS | low power | network-on-chip | 3D-NoC | industry | FDSOI

On the same theme

Browse the site

Alternative and Atomic Energies Agency

Browse the portal

The 3D-NoC network-on-chip developed by Leti, STMicroelectronics, and Mentor Graphics under a project coordinated by IRT Nanoelec offers 20% to 40% less energy consumption and higher speeds than other NoCs.