Event
VLSI 2021
From 4/19/2021 to 4/22/2021
Digital/hybrid Event
Detailed description
This international conference, organized by Industrial Technology Research Institute, is focused on the state-of-the-art technology R&D and macro development of semiconductor industry's future and has lasted for more than 30 years with more than 800 attendees annually from around the world.
We have a guest conference > Joint Session: Design-Technology Co-Optimization and advanced packaging for various applications at circuit and system level
Speaker:
Séverine Cheramy. The invited speaker for Joint Special Session-Design-Technology
Co-Optimization and Advanced Packaging at 2021 VLSI-TSA.
Invited papers:
Papers
| Authors
|
LCM: Impact of tunneling layer thickness and remanent polarization on the
electrical properties of scalable and BEOL compatible Ferroelectric Tunnel
Junctions with large ON/OFF ratio
| J. Barbot et al.
|
LCTE & LICL : Record RF Performance (ft=180GHz and fmax=240GHz) of a FDSOI NMOS
processed within a Low Thermal Budget for 3D Sequential Integration,
| T. Mota Frutuoso et al.
|
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