As a global pioneer in semiconductor R&D, CEA-Leti continues to redefine innovation by developing the cutting-edge hardware technologies that drive advances in AI. Leveraging expertise in silicon photonics, 3D integration, wide band gap semiconductors, microLEDs, and more, CEA-Leti is partnering with leading industrial players to drive the next generation of intelligent systems.

This year's theme, “Enabling AI: hardware innovation with the Taiwanese ecosystem," will showcase how groundbreaking technologies and collaborative approaches can bridge the gap between research and industrialization.

During this event, participants will:

• Gain insights into the latest technological advances in 3D integration, silicon photonics, wide band gap semiconductors and microLEDs thank to presentations by CEA experts.
• Discover how CEA collaborates with industry leaders to bridge the gap between research and industrialization.
• Explore opportunities for R&D partnerships with CEA and network with key players from Taiwan's semiconductor ecosystem.

Additional keynote speakers and panel participants will be announced soon to showcase the expertise of prominent industry leaders.

Don't miss this opportunity to learn how CEA-Leti and its partners are driving innovation.