Connectivity is one of the main driving forces behind every connected and intelligent system. Deep innovations are required in terms of materials, devices and systems in order to to ensure efficiency, sustainability and low power consumption.
During the Leti Devices Workshop, CEA-Leti experts will share their visions, innovations and achievements in the field of More than Moore applications.
Speakers
Thomas Signamarcheix
CEA-Leti
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Jean-René Lèquepeys
CEA-Leti
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Jamie Schaeffer
Globalfoundries
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Xavier Garros
CEA-Leti
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Daphnée Bosch
CEA-Leti
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Luca Lucci
CEA-Leti
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Cédric Dehos
CEA-Leti |
Sami Oukassi
CEA-Leti |
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Workshop Program
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5:30 p.m. - 7:00 p.m.
Explore a spectrum of topics through engaging presentations:
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Chairman & Master of Ceremony
Thomas Signamarcheix
Executive Vice President, Technology Planning & Strategic Programs, CEA-Leti
FAMES Pilot Line : Towards energy-saving chips for digital, analog, RF
Jean-René Lèquepeys
Deputy Director, CEA-Leti
Future Directions and Applications of FD-SOI
Jamie Schaeffer
Vice President - Product Management, Globalfoundries
Boosting connectivity with advanced 3D heterogeneous integration
Xavier Garros
Research Engineer, CEA-Leti
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3D sequential devices: from energy efficient computing to RFIC analogue stacking
Daphnée Bosch
Research Engineer, CEA-Leti
CMOS compatible GaN integration for enhanced connectivity and sensing
Luca Lucci
Research Engineer, CEA-Leti
Key enabling technologies for next generation wireless systems in the mmw/sub-THz bands
Cédric Dehos
Expert in mmw architecture and system design, CEA-Leti
Advanced RF filters for wireless communications
Sami Oukassi
Head of Laboratory for RF and Energy devices, CEA-Leti
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7:00 p.m. – 9:00 p.m.
Networking Reception with CEA-Leti's management and experts
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