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Event


Leti Devices Workshop 2023

The 12/10/2023
Nikko Hotel, 222 Mason Street, San Francisco, CA 94 702

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Efficiency and sustainability are primary concerns for the production of devices that rely on semiconductors. As a result, research must be organized to find smarter approaches for material integration, device efficiency and long-term sustainability. During the Leti Devices Workshop, CEA-Leti experts will share their visions, innovations and achievements in the field of More than Moore applications. 

​​​​Notably, the event will highlight key results in terms of efficient computing and radiofrequency devices.

During IEDM 2023, directly opposite the Hilton San Francisco Union Square

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Speakers


Thomas Signamarcheix​
VP Strategic Development,
CEA-Leti

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Jean-René Lèquepeys​
Deputy Director, CEA-Leti​


Elisa Vianello​
 Embedded AI Program Director, CEA-Leti​


Martin Gallezot​
Business Developer Semiconductor Technologies,
CEA-Leti​


Laurent Pain​
Sustainable Electronics Program Director​​,
CEA-Leti​


Thierry Poiroux​
Head of Characterization, Design and Simulation Section, CEA-Leti​


Tadeu Mota Frutuso​
Process Integration Engineer,
CEA-Leti

Paul Kelly
Chief Operating Officer and Vice President of Strategic Programs and New Ventures, NY CREATES​


​Workshop Program​

 

5:30 p.m. - 7:00 p.m.

Chairman
Thomas Signamarcheix
VP Strategic Development, CEA-Leti

Welcome & Introduction
Jean-René Lèquepeys​
Deputy Director, CEA-Leti​

Resistive memories: multifaceted impact on neuromorphic computing​​
Elisa Vianello​
Embedded AI Program Director, CEA-Leti​

Packaging and heterogeneous 3D integration: essential technology for semiconductors​
Martin Gallezot​
Business Developer Semiconductor Technologies, CEA-Leti​

Current & upcoming challenges for a sustainable semiconductor industry​​
Laurent Pain​
Sustainable Electronics Program Director​, CEA-Leti​

Design & technology: co-optimization to prepare the next energy-efficient FD-SOI node​
Thierry Poiroux​
Head of Characterization, Design and Simulation Department​, CEA-Leti​

Advances in 3D sequential integration technology and potential applications​​
Tadeu Mota Frutuso​
Process Integration Engineer, CEA-Leti​ 

Semiconductor R&D Centers: Meeting the Challenges for an Innovative and Sustainable Future​
Paul Kelly​​
Chief Operating Officer and Vice President of Strategic Programs and New Ventures, NY CREATES


 

7:00 p.m. – 9:00 p.m.​
Networking Reception with CEA-Leti's management and experts

Practical information



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