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Event | Agenda


EuroPAT 2023

From 9/6/2023 to 9/7/2023
Noviotech Campus, Netherlands

​​​​​​>>>  Meet CEA-Leti@EuroPAT2023​

The European Packaging, Assembly, and Test - Workshop 2023 aims to foster collaboration between semiconductor packaging, assembly, test and design experts across the semiconductor packaging supply chain, to collectively strengthen the semiconductor packaging ecosystem in Europe.​

  • CEA-Leti is a Lanyard Sponsor of the event.

  • Come and discuss with Jean Charles-Souriau the CEA-Leti expert on semiconductor packaging​


CEA-Leti is member of the SEMI integrated Packaging, Assembly, and Testing (SiPAT) Technology Community's which goal is to promote the sustainable development of the Semiconductor Packaging, Assembly, and Test industry in Europe.

CEA-LETI is focusing on achieving high levels of heterogeneous integration of technologies and components on a host silicon wafer through high-density interconnections (fine pitch) to meet requirements of HPC/edge-AI chiplets, optical computing, displays and imagers. It offers a wide range of advanced, complementary technologies such as Wafer Level Heterogeneous Integration, 3D Packaging, Chiplets interconnect on Si interposer, Hybrid Bonding, FanOut WLP and Flexible Packaging.​


Practical information

Web site : https://europat.org/​

Contact: Jean-charles.souriau@cea.fr

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    Wearable analytical devices capable of minimally invasive and real-time detection of biomarkers are revolutionizing the autonomous and continuous monitoring of bodily indicators. Interstitial fluid (ISF), the most abundant liquid in the human body, constitutes a very rich source of biomarkers. With a volume three times larger than blood, it shares with it a strong correlation in terms of composition. Microneedles (MNs), microstructures typically ranging from 400 to 1200 µm in height for humans, possess the ability to minimally invasively penetrate the skin and reach dermal ISF for its collection and/or in situ analysis. This workshop will discuss the development and applications of microneedle-based wearable devices for biosensing, giving full visibility to speakers from academia and industrial R&D teams, highlighting new ideas, research results, and development experiences. At the end of the workshop, a panel discussion for all the attendees will be organized, providing networking opportunities.

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  • 8 Dec
    17h30-21h      Leti Devices Workshop 2024

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    Efficiency and sustainability are now primary concerns for the production of devices that rely on semiconductors. As a result, research must be organized to find smarter approaches for material integration, device efficiency and long-term sustainability. During the Leti Devices Workshop, CEA-Leti experts will share their visions, innovations and achievements in the field of More than Moore applications. ​​​​Notably, the event will highlight key results in terms of efficient computing and radiofrequency devices.

  • 17 Jun
    2025
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    2025         CEA-Leti Innovation Days 2025

    Event |  Maison Minatec, Grenoble, France

    CEA-Leti Innovation Days is back for a new edition! CEA-Leti Innovation Days 2025 from 17 to 19 june will offer you a front-row seat to our most recent advances. Join more than 1,100 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!

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