>>> Meet CEA-Leti@EuroPAT2023
- CEA-Leti is a Lanyard Sponsor of the event.
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CEA-Leti is member of the SEMI integrated Packaging, Assembly, and Testing (SiPAT) Technology Community's which goal is to promote the sustainable development of the Semiconductor Packaging, Assembly, and Test industry in Europe.
CEA-LETI is focusing on achieving high levels of heterogeneous integration of technologies and components on a host silicon wafer through high-density interconnections (fine pitch) to meet requirements of HPC/edge-AI chiplets, optical computing, displays and imagers. It offers a wide range of advanced, complementary technologies such as Wafer Level Heterogeneous Integration, 3D Packaging, Chiplets interconnect on Si interposer, Hybrid Bonding, FanOut WLP and Flexible Packaging.