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CEA-Leti will present 3 papers on its latest developments in microelectronics packaging & 3D at ESTC conference.​​​

• 11 sept 2024 5:00-5:25 PM - Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations

Margot Faure, Christophe Dubarry, Pablo Renaud, Floriane Baudin, Sébastien Dominguez, Karine Abadie, Christophe Morales, Constantin Matei, Frank Fournel

• ​13 sept 2024 9:15-9:40 AM - First Electrical Performance of Self-assembly Applied to Die-to-wafer Hybrid Bonding

  Adèle Thiolon, Pierre Montméat, Thierry Enot, Alice Bond, Carine Ladner, Loic Sanchez, Alain Campo, Thomas Magis, Floriane Baudin, Sébastien Dominguez, Frank Fournel, Emilie Bourjot

  
  

• 11 sept 2024 3:30-3:55pm Superconducting Superlattice Interconnects for Cryogenic Systems

  Charles Bon-mardion, Edouard Deschaseaux, Thierry Farjot, Alain Campo, Frédéric Ritton, Rémi Vélard, Hélène Duchemin, Céline Feautrier, Jean-Luc Sauvageot, Jean Charbonnier, Candice Thomas​
  

  
  

Jean-Charles Souriau, a CEA project leader in the field of micro-interconnection and packaging, will present CEA-Leti-s activities in “Wafer Level Heterogeneous Integration" during EuroPAT-Workshop September 10^th.

Join CEA-Leti experts at booth #5 to discuss the findings presented.

​CEA-Leti's tech demos

Starac​

Chiplet-based Optical Network on Chip (ONoC)​​​

 

Next generation hybrid bonding​ ​

An enabling technology for new architectures​ ​

 

​​Fan-Out Wafer-Level Packaging​​​ ​

Advanced packaging technology for heterogeneous System-in-Package (SiP)

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ABOUT ESTC 2024​

​The 10th IEEE Electronics System-Integration Technology Conference will be taking place in Berlin from September 11-13, 2024. IEEE ESTC is the premier international event in the field of electronics packaging and system integration and the IEEE EPS flagship conference in Europe, co-sponsored by IMAPS Europe.

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​ More information on ESTC

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