CEA-Leti will present 3 papers on its latest developments in microelectronics packaging & 3D at ESTC conference.
- 11 sept 2024 5:00-5:25 PM - Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations
Margot Faure, Christophe Dubarry, Pablo Renaud, Floriane Baudin, Sébastien Dominguez, Karine Abadie, Christophe Morales, Constantin Matei, Frank Fournel
- 13 sept 2024 9:15-9:40 AM - First Electrical Performance of Self-assembly Applied to Die-to-wafer Hybrid Bonding
Adèle Thiolon, Pierre Montméat, Thierry Enot, Alice Bond, Carine Ladner, Loic Sanchez, Alain Campo, Thomas Magis, Floriane Baudin, Sébastien Dominguez, Frank Fournel, Emilie Bourjot
11 sept 2024 3:30-3:55pm Superconducting Superlattice Interconnects for Cryogenic Systems
Charles Bon-mardion, Edouard Deschaseaux, Thierry Farjot, Alain Campo, Frédéric Ritton, Rémi Vélard, Hélène Duchemin, Céline Feautrier, Jean-Luc Sauvageot, Jean Charbonnier, Candice Thomas
Jean-Charles Souriau, a CEA project leader in the field of micro-interconnection and packaging, will present CEA-Leti-s activities in “Wafer Level Heterogeneous Integration" during EuroPAT-Workshop September 10th.
Join CEA-Leti experts at booth #5 to discuss the findings presented.
CEA-Leti's tech demos
Starac
Chiplet-based Optical Network on Chip (ONoC)
Next generation hybrid bonding
An enabling technology for new architectures
Fan-Out Wafer-Level Packaging
Advanced packaging technology for heterogeneous System-in-Package (SiP)
ABOUT ESTC 2024
The 10th IEEE Electronics System-Integration Technology Conference will be taking place in Berlin from September 11-13, 2024. IEEE ESTC is the premier international event in the field of electronics packaging and system integration and the IEEE EPS flagship conference in Europe, co-sponsored by IMAPS Europe.
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