​Discover our latest developments for subTHz, 6G and 5G communications at European Microwave Week (EuMW), the most important conference on milimeter and radio frequency communications in Europe

The CEA-Leti is in the technical program committee of the EuMC Microwave Circuit conference, and member of the technical committee of the IEEE MTT Microwave Technical Transition: from component to system for RF, millimeter & microwave communications.

CEA-Leti will participate in two workshops  in room Amber 5:

📌On Monday 26th, as part of the European Microwave Conference (EuMC) and the workshop WM2: "Cryogenic RF-mmW Technology and circuit platforms: a path toward Quantum-Computing", Maud Vinet will talk about "Spin Qubit Quantum computing and needed readout electronics"

📌On Sunday 25th, as part of the European Microwave Integrated Circuits Conference (EuMIC) and the workshop WS5: "RF and mmW reliable ICs: characterization, test and security challenges", José Lugo will talk about RF characterization of active and passive devices integrated in advanced CMOS technology

CEA-Leti scientists will also present papers and poster on innovative passive and active circuits for 5G sub-6 GHz communications:

• On Monday, 26th at 02:40 p.m. – Amber 2 (EuMIC06-2): "a 2.5-2.6 dB Noise Figure LNA for 39 GHz band in 22 nm FD-SOI with Back-Gate Bias Tunability"

• On Tuesday 27th at 03:40 p.m. – Suite 2 (EuMIC/EuMC03-4): "a D-Band High-Gain Antenna Module Combining an In-Package Active Feed and a Flat Discrete Lens"
  

• On Wednesday 28th at 02:40 p.m. – Amber 4 (EuMC26-2): "BAW Filter for space applications at 4.2 GHz"

• And a poster on Tuesday 27th at 04:40 p.m. – Exhibition Hall (EuMIC/EuMC04-8) : "E-Band Magneto-Electric Dipole Antenna for 5G Backhauling applications"

Meet Leti's experts on the show floor at booth C32 level 0  to discover:

✅ a 300 GHz compact transmit array antenna,

✅ a prototype of steerable beam controllable transmit array operating at the KA-band,

✅ acoustic filters for C-band satellite communications,

✅ a D-band channel bonding emitter and receiver module integrating an active feed and a transmit array antenna, presented at this year conference.