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Dear partners,
CEA-Leti, IRT NanoElec and Qualcomm are pleased to invite you for a new 3DVLSI open Workshop dedicated to High Density 3D-IC and CoolCubeTM (Monolithic/Sequential 3D) technologies.
The workshop held:
Tuesday morning October 15th, 2019 (date to be confirmed)
At the DoubleTree by Hilton, 2050 Gateway Place - San Jose, CA 95110
The event is organized as a satellite event of the IEEE 2019 S3S conference to be held at the same location from October 14th to 17th, 2019.
The 3DVLSI open Workshop project's goals include building a complete ecosystem that takes the technology from design to fabrication.
A first 3DVLSI open Workshop was organized in San Diego back in 2014. Since then, we have seen presentations from Qualcomm, Applied Materials, ARM, Atrenta, Cadence, CEA-Leti, GeorgiaTech, Global Foundries, HPE, Intel, Mentor Graphics, TSMC and many more…
Now, the Workshop has become a forum for industrial partners and ecosystem to share research & development progress in making innovative High Density 3D technologies a truly feasible path towards 3DVLSI industrialization for reliable and cost effective products.
Registration – the event is free - is now open, please just return a mail to any of the organizer with your wish to participate and you will be in.
We are looking forward to welcoming you again.
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CONTACTS: PROGRAM:| 08:00am Workshop Opening |
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08:20am
| Opening Remarks
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08:30am
| 3D High Density: Which Technology? Wich Application?
- CEA-Leti, Severine Cheramy, 3D Business Development
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08:55am
| CEA-Leti in the Chiplet's Race: Status and Strategy
- CEA-Leti, Sébastien Thuriès, Design Scientist
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09:20am
| Designing Heterogeneous Chips With zGlue
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09:45am
| Advanced 3D Technologies for the Smart Image Sensors
- STMicroelectronics, François Guyader
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| 10:10am Break |
10:55am
| Die to Wafer Hybrid Bonding Equipment from R&D to HVM Production
- SET Smart Equipment Technology, Pascal Metzger
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11:20am
| Electroplating Innovations to Support Next Generation Advanced Packaging Solutions
- LAM Research, Stephen Banik
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11:45am
| 3D Integration Challenges and Benefits in our Ultra Low Digital Implementation Platform Nitro-SoC
- Mentor A Siemens Business, Kristian Zoerhoff
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12:10am
| Density Scaling Enabled by Recent Advances in Hybrid Bonding and Fusion Bonding Technology
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12:35am
| Advanced Processing Technologies Enabling 3D VLSI Integration
- APPLIED MATERIAL, Manish Hemkar
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| 13:00pm End of the Workshop & Lunch |