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3DVLSI Open Workshop 2019

From 10/15/2019 to 10/15/2019
DoubleTree by Hilton San Jose 2050 Gateway Place - San Jose, CA 95110

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​Dear partners,

CEA-Leti, IRT NanoElec and Qualcomm are pleased to invite you for a new 3DVLSI open Workshop dedicated to High Density 3D-IC and CoolCubeTM (Monolithic/Sequential 3D) technologies.

The workshop held:

  • Tuesday morning October 15th, 2019 (date to be confirmed)

  • At the DoubleTree by Hilton, 2050 Gateway Place - San Jose, CA 95110

The event is organized as a satellite event of the IEEE 2019 S3S conference to be held at the same location from October 14th to 17th, 2019.

The 3DVLSI open Workshop project's goals include building a complete ecosystem that takes the technology from design to fabrication.

A first 3DVLSI open Workshop was organized in San Diego back in 2014. Since then, we have seen presentations from Qualcomm, Applied Materials, ARM, Atrenta, Cadence, CEA-Leti, GeorgiaTech, Global Foundries, HPE, Intel, Mentor Graphics, TSMC and many more…

Now, the Workshop has become a forum for industrial partners and ecosystem to share research & development progress in making innovative High Density 3D technologies a truly feasible path towards 3DVLSI industrialization for reliable and cost effective products.

Registration – the event is free - is now open, please just return a mail to any of the organizer with your wish to participate and you will be in.  

We are looking forward to welcoming you again.


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CONTACTS: 
​Séverine CHERAMY
3D business developer
CEA-LETI
​Jean-Eric MICHALLET
Head of Microelectronics
Components
CEA-LETI
​Rashid ATTAR
Head of ASIC and Hardware R&D
Qualcomm Corporate Research
​Kambiz SAMADI
Senior Staff Engineer
Qualcomm Technology Inc.
PROGRAM:
​08:00am     Workshop Opening
​08:20am
​Opening Remarks
​08:30am
​3D High Density: Which Technology? Wich Application?
  • CEA-Leti, Severine Cheramy, 3D Business Development
​08:55am
​CEA-Leti in the Chiplet's Race: Status and Strategy
  • CEA-Leti, Sébastien Thuriès, Design Scientist
​09:20am
Designing Heterogeneous Chips With zGlue
  • zGlue, Jawad Nasrullah
​09:45am
​Advanced 3D Technologies for the Smart Image Sensors
  • STMicroelectronics, François Guyader
10:10am     Break
​10:55am
​Die to Wafer Hybrid Bonding Equipment from R&D to HVM Production
  • SET Smart Equipment Technology, Pascal Metzger
​11:20am
​Electroplating Innovations to Support Next Generation Advanced Packaging Solutions
  • LAM Research, Stephen Banik
​11:45am
​3D Integration Challenges and Benefits in our Ultra Low Digital Implementation Platform Nitro-SoC
  • Mentor A Siemens Business, Kristian Zoerhoff
​12:10am
​Density Scaling Enabled by Recent Advances in Hybrid Bonding and Fusion Bonding Technology
  • EV Group, Karine Abadie
​12:35am
​Advanced Processing Technologies Enabling 3D VLSI Integration
  • APPLIED MATERIAL, Manish Hemkar
​13:00pm      End of the Workshop & Lunch

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