08:30 a.m.: Registration & Welcome Coffee
09:00 a.m.: Opening Keynotes
Amir Amidi, Managing Partner, Plug and Play; Frédéric Jung, Consul General of France in San Francisco;
Ajit Manocha, CEO, SEMI; Rouzbeh Borhani, Head of Semiconductors, Plug and Play Tech Center; Michael Tchagaspanian, EVP Strategic Partnerships, CEA-Leti; Nicolas Bedouin, VP Partnerships North America, CEA
10:00 a.m.: Testimonies and Semiconductor Industry Corporate Keynotes
Jean-Philippe Ficker,
Founder & Chief System Architect, Cerebras Systems; Frédéric MORESTIN,
VP Marketing Imaging, STMicroelectonics
10:30 a.m.: Coffee break
10:45 a.m.: Semiconductor Deep Tech Devices and startups
MEMS-PMUT-OPTOMECA: Philippe Robert, MEMS Partnerships Manager, CEA-Leti; Jean-Philippe Polizzi, Micro & Nanosystems Project Manager, CEA-Leti; Marc Sensa Perna, Microsensors & Actuators Project Manager, CEA-Leti
Photoacoustic:Vincent Destefanis, Optical Sensors Industrial Partnerships Manager, CEA-Leti
Medical non-invasive sensors: Olivier Fuchs, Healthtech Partnerships Manager, CEA-Leti
Silicon Photonics: Bertrand Szelag, Integrated Photonics Program Manager, CEA-Leti |
12:00 a.m.: Lunch and Networking
01:00 p.m.: Testimonies and Semiconductor Industry Corporate Keynotes
Albert Orriols Puig,
VP AI Models,
HPinc; Umashankar Anandakumar,
Senior Director, Intel Corp.
01:30 p.m.: Semiconductor Deep Tech Devices and Startups
RF:
Baudoin Martineau, Head of RF Architecture & IC Design Lab, Senior Expert,CEA-Leti; Swan Gerome, Industrial Partnerships Manager, CEA-Leti
LED Datacom: Vygintas Jankus, MicroLED Parterships Manager, CEA-Leti
Fabrication tools and processes:
Philippe Rodriguez, Head of Memory & Computing Laboratory, CEA-Leti
3D integration and advanced packaging:
Sylvie Joly, 3D Integration & Bonding Division, CEA-Leti
Smart imaging:
William Guicquero, PhD Senior Research Engineer, CEA-Leti
AI & Chiplets and new architecture:
Olivier Thomas, Deputy Head of the Integrated Circuit & System Division, CEA-List
02:30 p.m.: Closing Remarks and Networking
03:30 p.m.: End of Event
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