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Leti @SPIE Advanced Lithography 2018

From 2/25/2018 to 3/1/2018
Convention Center San Jose, California, United States

This year, Leti researchers will present 8 papers, at SPIE Advanced Lithography 2018, the world's premiere lithography event where leaders come to solve challenges in lithography, patterning technologies, and materials for the semiconductor industry.

Leti also organizes a Workshop named "alternative lithography" in partnership with ARKEMA, EVG and MAPPER. Read more and register 

Don't miss your chance to connect with Leti Lithography experts!

Leti presentations:

  •  "Inorganic guiding template implementation for DSA contact hole shrink process"
Ahmed Gharbi, Florian Delachat, Patricia Pimenta-Barros, Gaëlle Chamiot-Maitral, Maxime Argoud, Celine Lapeyre, Laurent Pain, CEA-LETI (France); Christophe Navarro, Célia Nicolet, Ian Cayrefourcq, Arkema S.A. (France); Raluca Tiron, CEA-LETI (France). [10584-12]
February, 27, 2018 • 2:30 - 2:50 PM

 

  •  "Measurement of programmed LWR and LER by different metrology techniques", 
Jérôme Reche, CEA-LETI (France) and Univ. Grenoble Alpes (France) and Lab. des Technologies de La Microélectronique (France); Maxime Besacier, Univ. Grenoble Alpes (France) and Lab. des Technologies de La Microélectronique (France); Patrice Gergaud, Yoann Blancquaert, CEA-LETI (France); Guillaume Freychet, Lawrence Berkeley National Lab. (USA); Thibault Labbaye, CEA-LETI (France). . . . . . . . . . . [10585-14]
February, 27, 2018 • 9:00 - 9:20 AM

 

  •  "Overlay and stitching metrology for massively parallel electron-beam lithography"

Guido Rademaker, Jonathan Pradelles, Stéfan Landis, Stephane Rey, CEA-LETI (France); Anna Golotsvan, KLA-Tencor Corp. (Israel); Tal Itzkovich, KLA-Tencor Israel (Israel); Tetyana Shapoval, Ronny Haupt, KLATencor GmbH (Germany); Erwin Slot, Guido de Boer, Dhara Dave, Marco Wieland, MAPPER Lithography (Netherlands); Laurent Pain, CEA-LETI (France). . . . . . . [10585-29]

February, 27, 2018 • 4:40 - 5:00 PM

 

  • « Precise control of template affinity achieved by UV-assisted graphoepitaxy approach on silicon nanowires applications"

Patricia Pimenta-Barros, Guillaume Claveau, Maxime Argoud, Zdenek Chalupa, Nacima Allouti, Corinne Comboroure, Gaëlle Chamiot-Maitral, CEA-LETI (France); Christophe Navarro, Célia Nicolet, Ian Cayrefourcq, Arkema S.A. (France); Laurent Pain, Raluca Tiron, CEA-LETI (France). . . [10584-11]

February, 27, 2018 • 2:10 - 2:30 PM | Part of SPIE Advanced Lithography

 

  • "Pillars fabrication by DSA lithography: material and process options"
Ahmed Gharbi, Patricia Pimenta-Barros, Olivia Saouaf, Laurent Pain, CEA-LETI (France); Christophe Navarro, Célia Nicolet, Ian Cayrefourcq, Arkema S.A. (France); Michele Perego, Istituto per la Microelettronica e Microsistemi (Italy); Steven Gottlieb, Instituto de Microelectrónica de Barcelona (Spain); Esteve Amat, Ctr. Nacional de Microelectrónica (Spain); Marta Fernández-Regúlez, Instituto de Microelectrónica de Barcelona (Spain); Francesc Pérez-Murano, Ctr. Nacional de Microelectrónica (Spain); Raluca Tiron, CEA-LETI (France). . . [10586-25]

February, 28, 2018 • 9:40 - 10:00 AM

 

  •  "Advanced rules-based corrections strategies and their application for master manufacturing and replication on the 200mm wafer scale SmartNIL process"
Hubert Teyssedre, Jacky Chartoire, Patrick Quemere, Maryline Cordeau, Loïc Perraud, Stéfan Landis, Jérôme Hazart, Laurent Pain, CEA Grenoble (France). . [10588-6]

February, 28, 2018 • 11:30 - 11:50 AM

 

  •  "Evaluation of anti-sticking layers performances for 200mm wafer scale smart NILTM process through surface and defectivity characterizations"
Florian Delachat, CEA-LETI (France) and Pleiades Technologies (France); Jean-Côme Phillipe, Vincent Larrey, Frank Fournel, Sandra Bos, Stefan Landis, Hubert Teyssèdre, CEA-LETI (France); Jonas Khan, EV Group (Austria); Laurent Pain, CEA-LETI (France); Markus Wimplinger, EV Group (Austria); Xavier Chevalier, Célia Nicolet, Christophe Navarro, Ian Cayrefourcq, Arkema S.A. (France). . [10586-41]

March, 1st, 2018 • 9:20 - 9:40 AM

 

  • "Process development for the maskless N40 via layer for security application"
Isabelle Servin, Patricia Pimenta-Barros, Allan Germain, Arthur Bernadac, Jonathan Pradelles, Yoann Blancquaert, Philippe Essomba, Stéfan Landis, CEA-LETI (France); Gerard F. ten Berge, Marco Wieland, MAPPER Lithography (Netherlands). . . . . [10584-36]
1 March 2018 • 11:10 - 11:30 AM | Part of SPIE Advanced Lithography

Practical information

​Convention Center San Jose, Californie, Etat-Unis 

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    8h-18h      Workshop Microneedles for Biosensing

    Event | Agenda |  Grenoble, France

    Wearable analytical devices capable of minimally invasive and real-time detection of biomarkers are revolutionizing the autonomous and continuous monitoring of bodily indicators. Interstitial fluid (ISF), the most abundant liquid in the human body, constitutes a very rich source of biomarkers. With a volume three times larger than blood, it shares with it a strong correlation in terms of composition. Microneedles (MNs), microstructures typically ranging from 400 to 1200 µm in height for humans, possess the ability to minimally invasively penetrate the skin and reach dermal ISF for its collection and/or in situ analysis. This workshop will discuss the development and applications of microneedle-based wearable devices for biosensing, giving full visibility to speakers from academia and industrial R&D teams, highlighting new ideas, research results, and development experiences. At the end of the workshop, a panel discussion for all the attendees will be organized, providing networking opportunities.

  • 8 Dec au 11 Dec CEA-Leti at IEDM 2024 - San Francisco

    Event |  Hilton, San Francisco Union Square

    CEA-Leti to Present Research Breakthroughs in Non-Volatile Memory, RF and FD-SOI, and Other Highlights at December IEDM Gathering​ CEA-Leti will highlight its most recent research advances in several fields at the 2024 International Electron Devices Meeting (IEDM), Dec. 7-11, at the Hilton San Francisco Union Square.​

  • 8 Dec
    17h30-21h      Leti Devices Workshop 2024

    Event |  San Francisco

    Efficiency and sustainability are now primary concerns for the production of devices that rely on semiconductors. As a result, research must be organized to find smarter approaches for material integration, device efficiency and long-term sustainability. During the Leti Devices Workshop, CEA-Leti experts will share their visions, innovations and achievements in the field of More than Moore applications. ​​​​Notably, the event will highlight key results in terms of efficient computing and radiofrequency devices.

  • 17 Jun
    2025
    19 Jun
    2025         CEA-Leti Innovation Days 2025

    Event |  Maison Minatec, Grenoble, France

    CEA-Leti Innovation Days is back for a new edition! CEA-Leti Innovation Days 2025 from 17 to 19 june will offer you a front-row seat to our most recent advances. Join more than 1,100 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!

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