![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Visuel%20Leti%20Devices%20Workshop.png)
Pioneering Technologies for More than Moore
Thank you for attending Leti's workshop @IEDM. To download our presentations, please click below.
- Presentations -
![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/photo%20E.Sabonnadiere.png)
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/IEDM1.png)
| Jean-René Lequepeys VP Silicon Components Division, Leti
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/IEDM2.png)
| Léa Di Cioccio Scientific Advisor, Leti
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/IEDM3.png)
| Thomas Ernst Chief Scientist for Silicon Components and Technologies, Leti
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/IEDM4.png)
| Perrine Batude 3D Sequential Integration Technical Expert, Leti
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/IEDM5.png)
| Bertrand Szelag Project Manager Silicon Photonic Devices, Leti
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/john%20Pellerin.png)
| - Perspectives on Enabling Connected Intelligence through a More than Moore Roadmap
John Pellerin
Deputy CTO and Vice President of Worldwide R&D, GLOBALFOUNDRIES
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We are looking forward to seeing you again next year at our 2018 Leti's workshop @IEDM
Leti, the leading French technology-research institute, is very proud to invite you to
Leti's workshop @IEDM to be held in San Francisco, California, on December 3rd.
Simultaneously, Leti will present 11 papers at IEDM Conference 2017 in San Francisco, Dec. 2-6, including three invited papers on 3D sequential integration, advanced memory solutions and stacked nanowires FETs.
- Program -
![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/photo%20E.Sabonnadiere.png)
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Welcome: Leti celebrates 50 years of innovation
Emmanuel Sabonnadiere Leti, CEO
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/IEDM1.png)
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RF Devices: breakthroughs thanks to new materials
Jean-René Lequepeys VP Silicon Components Division, Leti
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/IEDM2.png)
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Power Devices: a new era of energy conversion with GaN
Léa Di Cioccio Scientific Advisor, Leti
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/IEDM3.png)
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New Sensors: emerging concepts at nanoscale
Thomas Ernst Chief Scientist for Silicon Components and Technologies, Leti
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/IEDM4.png)
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3D Technologies: a smart way to enhance performance
Perrine Batude 3D Sequential Integration Technical Expert, Leti
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/IEDM5.png)
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Si Photonics: latest innovations creating new markets
Bertrand Szelag Project Manager Silicon Photonic Devices, Leti
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![](/cea-tech/leti/PublishingImages/Actualités/Evenements/Program%20IEDM2017/john%20Pellerin.png)
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- Perspectives on Enabling Connected Intelligence through a More than Moore Roadmap
John Pellerin
Deputy CTO and Vice President of Worldwide R&D, GLOBALFOUNDRIES
The workshop will be followed by a cocktail reception.
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