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Presentations PDF LID 2018


Published on 7 September 2018


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To download our presentations, please click on the tittle of the presentations.

WEDNESDAY, JULY 4TH 2018:  FROM MICROELECTRONICS TO MARKETS / END-USERS
Keynote:  European FDSOI Roadmaps for Global leadership Thomas Morgenstern,  SVP & GM GLOBALFOUNDRIES  Fab 1
Keynotes: Microelectronics, fueling innovation 














Keynote: Computing NanoSystems for the Coming Superstorm of Abundant Data, Prof. S. Mitra, Stanford
Panel Session: What will tomorrow’s uses look like?
 


        - R.Watt, Director of Vehicle Architecture and System Analysis  ARM






       ​V.Roger, Leti

Microelectronics in Space: A key to Understanding the Cosmos,  Hervé Gilibert, CTO  ArianeGroup

THURSDAY, JULY 5TH, 2018:  NOVEL USES IN AN HYPERCONNECTED WORLD 
Demonstrations session: 


  • Connected Skiing Wearables, B. Cercley, President & CEO Skis Rossignol SAS  






​Keynote: Latest update: Brain Computer Interface, Prof AL. Benabid, Clinatec


Keynote: Innovations & Breakthroughs for oil and gas industry, A. Belani, EVP, Schlumberger  




​KeynoteSemiconductor for industry 4.0, J.Hartmann,Executive Vice President; Digital Front-End Manufacturing & Technology, STMicroelectronics


Keynote: How material engineering contributes to delivering innovation in the hyper connected world,P.Boudre, Soitec CEO



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