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From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose

Published on 29 March 2018
From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose
Description
 
Date 
Authors
Cibrario G., Ben Salem N., Lacord J., Azizi-Mourier K., Rozeau O., Maurin E., Billoint O., Thuries S., Valentian A.
Year2017-0338
Source-Title2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
Affiliations
Univ. Grenoble Alpes, Grenoble, France, CEA, LETI, MINATEC Campus, Grenoble, France, STMicroelectronics, 850 rue Jean Monnet, Crolles, France
Abstract
3D sequential integration known as Monolithic 3D (M3D) is considered as an alternative solution to CMOS scaling [1]. In this paper, we detail an innovative methodology migrating a 2D Process Design Kit (PDK) and its associated standard cells libraries to a M3D CoolCube™ design platform [2]. This methodology exhibits a significant migration runtime reduction almost regardless of the number of design rules and standard cells layout complexity (multi-patterning) in advanced CMOS nodes. This migration allows gate level evaluation through a Power Performance Area (PPA) analysis and is based on the following assumptions and targets: 1) same mask sequence and model cards on both level 2) identical process node, design rules and parameters on both levels 3) cell on cell approach. © 2016 IEEE.
Author-Keywords
CoolCube™, Design methodology, Design migration, Design platform, Monolithic 3D, PDK, Standard cells
Index-Keywords
Cells, CMOS integrated circuits, Cytology, Integrated circuit design, Integration, Three dimensional integrated circuits, Alternative solutions, Design Methodology, Design platform, Identical process, Innovative methodologies, Layout complexity, Process design kit, Standard cell, Design
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