From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose
| Description | |
| Date | |
| Authors | Cibrario G., Ben Salem N., Lacord J., Azizi-Mourier K., Rozeau O., Maurin E., Billoint O., Thuries S., Valentian A. |
| Year | 2017-0338 |
| Source-Title | 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 |
| Affiliations | Univ. Grenoble Alpes, Grenoble, France, CEA, LETI, MINATEC Campus, Grenoble, France, STMicroelectronics, 850 rue Jean Monnet, Crolles, France |
| Abstract | 3D sequential integration known as Monolithic 3D (M3D) is considered as an alternative solution to CMOS scaling [1]. In this paper, we detail an innovative methodology migrating a 2D Process Design Kit (PDK) and its associated standard cells libraries to a M3D CoolCube™ design platform [2]. This methodology exhibits a significant migration runtime reduction almost regardless of the number of design rules and standard cells layout complexity (multi-patterning) in advanced CMOS nodes. This migration allows gate level evaluation through a Power Performance Area (PPA) analysis and is based on the following assumptions and targets: 1) same mask sequence and model cards on both level 2) identical process node, design rules and parameters on both levels 3) cell on cell approach. © 2016 IEEE. |
| Author-Keywords | CoolCube™, Design methodology, Design migration, Design platform, Monolithic 3D, PDK, Standard cells |
| Index-Keywords | Cells, CMOS integrated circuits, Cytology, Integrated circuit design, Integration, Three dimensional integrated circuits, Alternative solutions, Design Methodology, Design platform, Identical process, Innovative methodologies, Layout complexity, Process design kit, Standard cell, Design |
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| Link | Link |