Towards high density 3D interconnections
| Description | |
| Date | |
| Authors | Cheramy S., Jouve A., Arnaud L., Fenouillet-Beranger C., Batude P., Vinet M. |
| Year | 2017-0344 |
| Source-Title | 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 |
| Affiliations | CEA, LETI, MINATEC Campus, 17 rue des Martyrs, Grenoble, France |
| Abstract | System integration takes benefit from 3D stacking technologies in a wide range of applications such as smart imagers, photonics, stacked memories, mobile applications and high-performance computing. Several integration schemes are considered worldwide to address applications specific requirements: performance, cost, form-factor, thermal management or even supply chain availability. This paper presents two 3D-high density (with 3D interconnects pitch around or below the ?m range) schemes using on one side hybrid bonding and on the other one monolithic integration. Both integrations are described and current status are given. A technology/application roadmap is proposed positioning both integrations and showing that they offer complementary approaches to tackle most of today challenges in terms of cost, area, power and performance. © 2016 IEEE. |
| Author-Keywords | 3D Monolithic integration, 3D stacking, Coolcube™, Hybrid Bonding |
| Index-Keywords | Supply chains, Three dimensional integrated circuits, 3D stacking, 3D stacking technology, High performance computing, Hybrid bonding, Integration scheme, Mobile applications, Monolithic integration, System integration, Monolithic integrated circuits |
| ISSN | |
| Link | Link |