CEA, LETI, MINATEC Campus, Grenoble, France

This work aims at providing a RLCG modeling ofthe 10 ?m fine-pitch microbump type interconnects in the 100 MHz-40 GHz frequency band based on characterization approach. RF measurements are performed on two-port test structures within a short-loop with chip to wafer assembly using the fine pitch 10 ?m Cu-pillar on a 10 Ohm.cm substrate resistivity silicon interposer. Accuracy is obtained thanks to a coplanar transmission line using 44 Cu-pillar transitions. To the author knowledge, it is the first time that RLCG modeling of fine-pitch Cu-pillar is extracted from experimental results. Another goal of this work is to get a better understanding of the main physical effects over a wide frequency range, especially concerning the key parameter of fine pitch Cu-pillar, i.e. the resistance. Finally, analysis based on the proposed RLCG modeling are performed to optimize over frequency the resistive interposer-to-chip link thanks to process modifications mitigating high frequency parasitic effects. © 2017 IEEE.

CPW, Cu-pillar, Fine pitch interconnects, Flip-chip, Microbump, NCP underfill, RF characterization, RLCG modeling, Skin effect

Characterization, Frequency bands, Network components, Silicon wafers, Skin effect, Cu pillar, Fine pitch interconnects, Flip chip, Micro-bumps, RF characterization, Underfills, Integrated circuit interconnects