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Advances in the understanding of microscopic switching mechanisms in ReRAM devices (Invited paper)

Published on 29 March 2018
Advances in the understanding of microscopic switching mechanisms in ReRAM devices (Invited paper)
Description
 
Date 
Authors
Skienard B., Blaise P., Traore B., Dragoni A., Nail C., Vianello E.
Year2017-0467
Source-TitleEuropean Solid-State Device Research Conference
Affiliations
Univ. Grenoble Alpes, Grenoble, France, CEA, LETI, MINATEC, Grenoble, France, Institut des Sciences Chimiques de Rennes (ISCR), Universite de Rennes, CNRS, Rennes, France, CNRS, Institut Neel, Grenoble, France, LTM, CNRS, Grenoble, France
Abstract
In this paper we present the recent advances in the understanding of microscopic mechanisms driving the resistive switching in ReRAM devices using ab initio theoretical methods. We highlight the complex interplay between interface reactions and charge injection in the generation of oxygen Frenkel pairs during the forming step. Energy barrier calculations suggest that the formation/destruction of the conductive filament can be due to movements of oxygen vacancies composing the filament or interaction with oxygen atoms released from the metal electrode. © 2017 IEEE.
Author-Keywords
 
Index-Keywords
Calculations, Oxygen, RRAM, Solid state devices, Conductive filaments, Frenkel pairs, Interface reactions, Metal electrodes, Microscopic mechanisms, Microscopic switching, Resistive switching, Theoretical methods, Oxygen vacancies
ISSN19308876
LinkLink

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