Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications
| Description | |
| Date | |
| Authors | Montméat P., Enot T., De Marco Dutra M., Pellat M., Fournel F. |
| Year | 2017-0204 |
| Source-Title | Microelectronic Engineering |
| Affiliations | CEA Leti, Minatec Campus, Grenoble, France |
| Abstract | This paper concerns the study of a temporary bonding process: 3MTM Wafer Support System. This process is dedicated to the handling of thin silicon wafers with a glass carrier bonded with a UV curable polymer. The dismounting process is achieved after a laser treatment. Firstly, the 300 mm bonding process leads to a very homogeneous bonded structure without any bonding defects. The morphology of the bonded structure is mainly dependent of the morphology of the glass. Secondly this process is also compatible with a back – grinding process and the thinned silicon structure can be processed up to 250 °C. When using a blank silicon wafer, the 3MTM dismounting process (laser and peeling) leads to a silicon thin wafer without any cracks, chippings or adhesive traces. Finally the laser process can be removed from the debonding steps and a single mechanical dismounting process can be used. © 2017 Elsevier B.V. |
| Author-Keywords | 3D integration, Adherence, Adhesive, Bonding, Temporary |
| Index-Keywords | Adhesives, Bonding, Curing, Debonding, Glass, Silicon, Silicon wafers, 3-D integration, Adherence, Silicon structures, Temporary, Temporary bondings, Thin silicon wafer, UV curable adhesive, UV curable polymer, Wafer bonding |
| ISSN | 1679317 |
| Link | Link |