You are here : Home > Inverse heat conduction problem in a phase change memory device

Publications

Inverse heat conduction problem in a phase change memory device

Published on 29 March 2018
Inverse heat conduction problem in a phase change memory device
Description
 
Date 
Authors
Battaglia J.-L., De I., Sousa V.
Year2017-0111
Source-TitleJournal of Physics: Conference Series
Affiliations
I2M Laboratory, University of Bordeaux, UMR CNRS 5295, 351 cours de la liberation, Talence Cedex, France, CEA-LETI, MINATEC, 17 rue des Martyrs, Grenoble Cedex 9, France
Abstract
An invers heat conduction problem is solved considering the thermal investigation of a phase change memory device using the scanning thermal microscopy. The heat transfer model rests on system identification for the probe thermal impedance and on a finite element method for the device thermal impedance. Unknown parameters in the model are then identified using a nonlinear least square algorithm that minimizes the quadratic gap between the measured probe temperature and the simulated one.
Author-Keywords
 
Index-Keywords
Finite element method, Heat sinks, Heat transfer, Inverse problems, Nanotechnology, Phase change memory, Probes, Heat conduction problems, Heat transfer model, Inverse heat conduction problem, Non-linear least squares, Scanning thermal microscopy, Thermal impedance, Heat conduction
ISSN17426588
LinkLink

Retour à la liste