HIGH-ADDED-VALUE MODULES AND INTERNATIONAL R&D PARTNERSHIPS
The 12 inches nanoelectronics platform develops advanced transistors, integrated circuits, and non-volatile memory. It is also where FD-SOI—today used to mass-produce chips worldwide—was born. The platform also conducts 3D integration R&D.
The platform’s scope covers simulation, technology development, demonstrators and prototyping, advanced characterization, and reliability testing. The platform can also conduct short-loop proof-of-concept testing with wafer manufacturing sites. Foundries, fabless manufacturers, integrators, and materials and equipment manufacturers that partner with the platform benefit from high-added-value modules offering excellent energy consumption, speed, and frequency—ideal for the microcontrollers used in the automotive and medical industries and for smart cards, for example. The platform is one of the world’s top five 300 mm nanoelectronics R&D centers, and counts fifteen strategic partnerships with organizations in the US and Europe. The platform is also home to advanced know-how in e-beam lithography, a potential alternative to optical lithography in achieving ultimate resolution.
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